Characterization of chemically-deposited NiB and NiWB thin films as a capping layer for ULSI application

Authors :: Tetsuya Kurokawa
Nao Takano
Kazuyoshi Ueno
Tomomi Kaneko
Tetsuya Osaka
Source :: Surface and Coatings Technology. :124-127
Publication Year :: 2003
Publisher :: Elsevier BV, 2003.
Abstract: NiB and NiWB films fabricated by electroless deposition were evaluated aiming for the application to a metal cap in the copper interconnects technology. The content of B and W was varied by adjusting the concentration of components in electroless deposition baths in order to clarify the effect of co-deposited element on thermal stability of the films. The thermal stability was evaluated by Auger electron spectroscope, X-ray diffractometer (XRD) and sheet resistance measurement. By measuring the variation in sheet resistance with annealing temperature, it was confirmed that the NiB films showed good thermal stability up to 450 °C, whereas the NiWB films deteriorated at 300 °C. The effect of co-deposited element was discussed based on the results obtained by XRD as well as that of sheet resistance measurement.

Subjects :: Auger electron spectroscopy
Materials science
Annealing (metallurgy)
Metallurgy
chemistry.chemical_element
Surfaces and Interfaces
General Chemistry
Condensed Matter Physics
Tungsten borides
Copper
Surfaces, Coatings and Films
chemistry.chemical_compound
chemistry
Materials Chemistry
Thermal stability
Thin film
Composite material
Sheet resistance
Diffractometer

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