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Research in the Simulation Model of IGBT Package
- Source :
- 2013 Sixth International Symposium on Computational Intelligence and Design.
- Publication Year :
- 2013
- Publisher :
- IEEE, 2013.
-
Abstract
- Simulation technology provides a powerful tool for the IGBT module design. The IGBT chip model and the interconnect parasitics are the most important factors for the package design of IGBT module. By the aid of the simulation software, the IGBT chip model is fulfilled and the package parasitics is extracted. So the whole simulation deign platform of IGBT package achieves.
- Subjects :
- business.industry
Computer science
Hardware_PERFORMANCEANDRELIABILITY
Insulated-gate bipolar transistor
Integrated circuit design
computer.software_genre
Chip
Simulation software
Interconnect parasitics
Chip-scale package
Embedded system
Hardware_INTEGRATEDCIRCUITS
Electronic engineering
Integrated circuit packaging
Parasitic extraction
business
computer
Subjects
Details
- Database :
- OpenAIRE
- Journal :
- 2013 Sixth International Symposium on Computational Intelligence and Design
- Accession number :
- edsair.doi...........09e15ac6336a38cb3db09036cee4f3a4