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Research in the Simulation Model of IGBT Package

Authors :
Bao Hailong
Zhang Yu
Che Jiajie
Jin Rui
Zhang Peng
Han Ronggang
Liu Jun
Yu Kunshan
Source :
2013 Sixth International Symposium on Computational Intelligence and Design.
Publication Year :
2013
Publisher :
IEEE, 2013.

Abstract

Simulation technology provides a powerful tool for the IGBT module design. The IGBT chip model and the interconnect parasitics are the most important factors for the package design of IGBT module. By the aid of the simulation software, the IGBT chip model is fulfilled and the package parasitics is extracted. So the whole simulation deign platform of IGBT package achieves.

Details

Database :
OpenAIRE
Journal :
2013 Sixth International Symposium on Computational Intelligence and Design
Accession number :
edsair.doi...........09e15ac6336a38cb3db09036cee4f3a4