Copper-parylene interactions in multilevel interconnection structures

Authors :: S. Dabral
Hassaram Bakhru
G.-R. Yang
Toh-Ming Lu
John F. McDonald
Source :: Seventh International IEEE Conference on VLSI Multilevel Interconnection.
Publication Year :: 2002
Publisher :: IEEE, 2002.
Abstract: Copper is investigated as an interconnect metal and parylene as the interlayer dielectric. It has been found that copper adheres to the parylene well. The effect of a soldering step has been simulated by annealing. Using Rutherford backscattering (RBS) and secondary ion mass spectroscopy (SIMS) it has been found that copper does indeed diffuse into the parylene at elevated temperatures. However, this diffusion is small and does not affect the dielectric leakage properties much. >

Subjects :: Interconnection
Materials science
Annealing (metallurgy)
Analytical chemistry
chemistry.chemical_element
Dielectric
Copper
Metal
chemistry.chemical_compound
Parylene
chemistry
visual_art
Soldering
visual_art.visual_art_medium
Composite material
Leakage (electronics)

Database :: OpenAIRE
Journal :: Seventh International IEEE Conference on VLSI Multilevel Interconnection
Accession number :: edsair.doi...........0ba9d0255ff79d103dc8753a54848596
Full Text :: https://doi.org/10.1109/vmic.1990.127892