Cite
Characterization of Temporary Bonding and Laser Release Using Polyimide and a 300-nm Photolysis Polymer System for High-Throughput 3-D IC Applications
MLA
Tsung-Yen Tsai, et al. “Characterization of Temporary Bonding and Laser Release Using Polyimide and a 300-Nm Photolysis Polymer System for High-Throughput 3-D IC Applications.” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, Mar. 2017, pp. 456–62. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........0dc2fe3c4c257c4d78dbc426af7431ef&authtype=sso&custid=ns315887.
APA
Tsung-Yen Tsai, Chuan-An Cheng, Shan-Chun Yang, Chia-Lin Lee, Kuan-Neng Chen, Yu-Hsiang Huang, & Chien-Hung Lin. (2017). Characterization of Temporary Bonding and Laser Release Using Polyimide and a 300-nm Photolysis Polymer System for High-Throughput 3-D IC Applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7, 456–462.
Chicago
Tsung-Yen Tsai, Chuan-An Cheng, Shan-Chun Yang, Chia-Lin Lee, Kuan-Neng Chen, Yu-Hsiang Huang, and Chien-Hung Lin. 2017. “Characterization of Temporary Bonding and Laser Release Using Polyimide and a 300-Nm Photolysis Polymer System for High-Throughput 3-D IC Applications.” IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (March): 456–62. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........0dc2fe3c4c257c4d78dbc426af7431ef&authtype=sso&custid=ns315887.