Microstructure and mechanical strength of Cu/Sn/Cu microbump via Ni and Zn doping into Cu substrate

Subjects

Subjects :

General Materials Science
Condensed Matter Physics

Details

ISSN :

02540584

Volume :

298

Database :

OpenAIRE

Journal :

Materials Chemistry and Physics

Accession number :

edsair.doi...........10fe1881f1015fd0cc80464d19b0fa34

Full Text :

https://doi.org/10.1016/j.matchemphys.2023.127392