Thermal Modeling and Experimental Analysis of High Power LED using POL-kw Packaging Technology

In this paper, an “embedded chip” packaging platform using POL-kW packaging for use with High Power LED devices is presented. Prototype samples have been fabricated and tested. The authors will describe thermal modeling analysis as well as experimental results from the prototype samples. A thermal simulation model has been developed to look at the thermal properties and attributes of the POL-kW LED structure and will be compared to conventional AlN and IMS based LED packages. The process flow and fabrication details of a POL-kW LED package will be summarized to provide a better understanding of the technical and performance advantages. Initial results have shown that the presence of POL vias directly connected to the LED chip reduce the thermal path and, thereby, the thermal resistance of the package. Furthermore, the POL-kw LED package offers a thinner profile and smaller form factors which allows higher integration density.