Quality Improvement by Preliminary Action through the Semiconductor Wire Bonding Process TRIZ

MLA

Kwang Jun Lee, et al. “Quality Improvement by Preliminary Action through the Semiconductor Wire Bonding Process TRIZ.” Asia-Pacific Journal of Convergent Research Interchange, vol. 7, Nov. 2021, pp. 15–28. EBSCOhost, https://doi.org/10.47116/apjcri.2021.11.02.

APA

Kwang Jun Lee, Hong Kyun Shim, Yong Won Song, Chan Ho Park, & Sang Ook Jun. (2021). Quality Improvement by Preliminary Action through the Semiconductor Wire Bonding Process TRIZ. Asia-Pacific Journal of Convergent Research Interchange, 7, 15–28. https://doi.org/10.47116/apjcri.2021.11.02

Chicago

Kwang Jun Lee, Hong Kyun Shim, Yong Won Song, Chan Ho Park, and Sang Ook Jun. 2021. “Quality Improvement by Preliminary Action through the Semiconductor Wire Bonding Process TRIZ.” Asia-Pacific Journal of Convergent Research Interchange 7 (November): 15–28. doi:10.47116/apjcri.2021.11.02.