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A method for building low loss multi-layer wiring for superconducting microwave devices
- Source :
- Applied Physics Letters. 112:063502
- Publication Year :
- 2018
- Publisher :
- AIP Publishing, 2018.
-
Abstract
- Complex integrated circuits require multiple wiring layers. In complementary metal-oxide-semiconductor processing, these layers are robustly separated by amorphous dielectrics. These dielectrics would dominate energy loss in superconducting integrated circuits. Here, we describe a procedure that capitalizes on the structural benefits of inter-layer dielectrics during fabrication and mitigates the added loss. We use a deposited inter-layer dielectric throughout fabrication and then etch it away post-fabrication. This technique is compatible with foundry level processing and can be generalized to make many different forms of low-loss wiring. We use this technique to create freestanding aluminum vacuum gap crossovers (airbridges). We characterize the added capacitive loss of these airbridges by connecting ground planes over microwave frequency λ/4 coplanar waveguide resonators and measuring resonator loss. We measure a low power resonator loss of ∼3.9 × 10−8 per bridge, which is 100 times lower than that of dielectric supported bridges. We further characterize these airbridges as crossovers, control line jumpers, and as part of a coupling network in gmon and fluxmon qubits. We measure qubit characteristic lifetimes (T1s) in excess of 30 μs in gmon devices.
- Subjects :
- Coupling
Fabrication
Materials science
Physics and Astronomy (miscellaneous)
business.industry
Coplanar waveguide
Capacitive sensing
02 engineering and technology
Dielectric
Integrated circuit
021001 nanoscience & nanotechnology
01 natural sciences
law.invention
Resonator
law
0103 physical sciences
Optoelectronics
010306 general physics
0210 nano-technology
business
Microwave
Subjects
Details
- ISSN :
- 10773118 and 00036951
- Volume :
- 112
- Database :
- OpenAIRE
- Journal :
- Applied Physics Letters
- Accession number :
- edsair.doi...........15a2c43a2d746f32654671982996cea1
- Full Text :
- https://doi.org/10.1063/1.5014033