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Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits
- Source :
- IEEE Photonics Technology Letters. 11:128-130
- Publication Year :
- 1999
- Publisher :
- Institute of Electrical and Electronics Engineers (IEEE), 1999.
-
Abstract
- We describe the first integration of vertical-cavity surface-emitting laser arrays with gigabit-per-second CMOS circuits via flip-chip bonding.
- Subjects :
- Materials science
Physics::Instrumentation and Detectors
business.industry
ComputingMethodologies_IMAGEPROCESSINGANDCOMPUTERVISION
Physics::Optics
Hardware_PERFORMANCEANDRELIABILITY
Laser
GeneralLiterature_MISCELLANEOUS
Atomic and Molecular Physics, and Optics
Computer Science::Other
Electronic, Optical and Magnetic Materials
law.invention
Computer Science::Hardware Architecture
Computer Science::Emerging Technologies
CMOS
law
Gigabit
Hardware_INTEGRATEDCIRCUITS
Optoelectronics
Electrical and Electronic Engineering
business
Flip chip
Hardware_LOGICDESIGN
Electronic circuit
Subjects
Details
- ISSN :
- 19410174 and 10411135
- Volume :
- 11
- Database :
- OpenAIRE
- Journal :
- IEEE Photonics Technology Letters
- Accession number :
- edsair.doi...........19350e5543dae42b6c915c758cbcdebe
- Full Text :
- https://doi.org/10.1109/68.736418