Back to Search Start Over

Thermal Property of Lotus-Type Porous Copper and Application to Heat Sinks

Authors :
Hiroshi Chiba
Hideo Nakajima
Tetsuro Ogushi
Masakazu Tane
Source :
Cellular and Porous Materials: Thermal Properties Simulation and Prediction
Publication Year :
2008
Publisher :
Wiley-VCH Verlag GmbH & Co. KGaA, 2008.

Subjects

Subjects :
Heat pipe
Materials science
chemistry
Heat transfer
Thermal
Heat spreader
chemistry.chemical_element
Heat sink
Composite material
Porosity
Copper
Copper in heat exchangers

Details

Database :
OpenAIRE
Journal :
Cellular and Porous Materials: Thermal Properties Simulation and Prediction
Accession number :
edsair.doi...........199efe255b4752f8fb022169e3dbd6ca
Full Text :
https://doi.org/10.1002/9783527621408.ch8
Full Text Access
View/download PDF

Tools

Authors Abstract Subjects Details