Halbach-Array Magnetic Coil Arrangement on CMOS Chip for Sensitivity Enhancement of Inductive Tactile Sensor

MLA

Tien Chou, et al. “Halbach-Array Magnetic Coil Arrangement on CMOS Chip for Sensitivity Enhancement of Inductive Tactile Sensor.” 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS), Jan. 2023. EBSCOhost, https://doi.org/10.1109/mems49605.2023.10052312.

APA

Tien Chou, Zih-Song Hu, & Weileun Fang. (2023). Halbach-Array Magnetic Coil Arrangement on CMOS Chip for Sensitivity Enhancement of Inductive Tactile Sensor. 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS). https://doi.org/10.1109/mems49605.2023.10052312

Chicago

Tien Chou, Zih-Song Hu, and Weileun Fang. 2023. “Halbach-Array Magnetic Coil Arrangement on CMOS Chip for Sensitivity Enhancement of Inductive Tactile Sensor.” 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS), January. doi:10.1109/mems49605.2023.10052312.