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Conformal Hermetic Sealing of Wireless Microelectronic Implantable Chiplets by Multilayered Atomic Layer Deposition (ALD)
- Source :
- Advanced Functional Materials. 29:1806440
- Publication Year :
- 2018
- Publisher :
- Wiley, 2018.
- Subjects :
- Materials science
business.industry
0206 medical engineering
Conformal map
02 engineering and technology
021001 nanoscience & nanotechnology
Condensed Matter Physics
020601 biomedical engineering
Electronic, Optical and Magnetic Materials
Hafnium oxide
Biomaterials
Atomic layer deposition
Brain implant
Electrochemistry
Wireless
Optoelectronics
Microelectronics
Hermetic packaging
0210 nano-technology
business
Subjects
Details
- ISSN :
- 16163028 and 1616301X
- Volume :
- 29
- Database :
- OpenAIRE
- Journal :
- Advanced Functional Materials
- Accession number :
- edsair.doi...........1b3360a705289d2232d510212700b3ae
- Full Text :
- https://doi.org/10.1002/adfm.201806440