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Stress Analysis and Optimization of BGA Solder Joints Under Thermal Fatigue Loading by Solder Joint Structural Parameters
- Source :
- 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
- Publication Year :
- 2022
- Publisher :
- IEEE, 2022.
Details
- Database :
- OpenAIRE
- Journal :
- 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
- Accession number :
- edsair.doi...........1b92f045914cb08e3bf5fa3a7a76e317