On baking a cryopumped UHV system

Authors :: E. H. C. Parker
W. Y. Leong
R. M. King
R. A. A. Kubiak
Source :: Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 1:1872-1873
Publication Year :: 1983
Publisher :: American Vacuum Society, 1983.
Abstract: The problems of the thermal loading of cryopumps during bakeout of UHV systems are considered. A simple design of thermal baffle is presented which permits baking at temperatures of 200 °C without compromising the high speed of the pump during normal system operation.

Subjects :: Materials science
Nuclear engineering
Thermal
Baffle
Surfaces and Interfaces
Condensed Matter Physics
Surfaces, Coatings and Films

ISSN :: 15208559 and 07342101
Volume :: 1
Database :: OpenAIRE
Journal :: Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
Accession number :: edsair.doi...........1d751752f69955f399bdcc5a53668141
Full Text :: https://doi.org/10.1116/1.572231