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Semiconductor component qualification

Authors :
Mei-Ling Wu
Michael Pecht
Source :
2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference.
Publication Year :
2009
Publisher :
IEEE, 2009.

Abstract

Semiconductor component manufacturers supply to different products in a wide range of market segments, and therefore the end use conditions may not always be known. Qualifying a semiconductor component or demonstrating that it can operate reliably under use conditions can therefore be a challenging task. The goal of this paper is to describe the challenges in semiconductor component qualification and demonstrate how use conditions and product configuration can influence reliability and therefore qualification test selection. Industry practices on component qualification are summarized and an ideal component qualification plan that takes into account end use conditions and product configuration is described.

Details

Database :
OpenAIRE
Journal :
2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference
Accession number :
edsair.doi...........1f298fe957807a357703b472cc5f1cbb
Full Text :
https://doi.org/10.1109/impact.2009.5382267