Thermal stress and drop stress analysis based on 3D package reliability study

Subjects

Subjects :

Electrical and Electronic Engineering
Safety, Risk, Reliability and Quality
Condensed Matter Physics
Atomic and Molecular Physics, and Optics
Surfaces, Coatings and Films
Electronic, Optical and Magnetic Materials

Details

ISSN :

00262714

Volume :

141

Database :

OpenAIRE

Journal :

Microelectronics Reliability

Accession number :

edsair.doi...........1f733cec3cafbe0b8d3358ebe748825a

Full Text :

https://doi.org/10.1016/j.microrel.2022.114888