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Thinning Process Induced Surface Defects in Ultra-Thin Si Wafer
- Source :
- Extended Abstracts of the 2011 International Conference on Solid State Devices and Materials.
- Publication Year :
- 2011
- Publisher :
- The Japan Society of Applied Physics, 2011.
Details
- Database :
- OpenAIRE
- Journal :
- Extended Abstracts of the 2011 International Conference on Solid State Devices and Materials
- Accession number :
- edsair.doi...........22cdefa13eb523d4132b662cffa457f5
- Full Text :
- https://doi.org/10.7567/ssdm.2011.p-2-2