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Characterization of epoxy based highly filled die attach materials in microelectronics
- Source :
- 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
- Publication Year :
- 2017
- Publisher :
- IEEE, 2017.
-
Abstract
- In semiconductor technologies thermally and electrically conductive adhesives are widely used to attach the die to the substrate. Focus of this work are Isotropic Conductive Adhesives (ICA) with a high amount of electrically conductive filler particles and the characterization of such materials.
- Subjects :
- Materials science
business.industry
0211 other engineering and technologies
Electrically conductive
Isotropic conductive adhesives
02 engineering and technology
Epoxy
021001 nanoscience & nanotechnology
Semiconductor
visual_art
021105 building & construction
visual_art.visual_art_medium
Microelectronics
Adhesive
Composite material
0210 nano-technology
business
Material properties
Curing (chemistry)
Subjects
Details
- Database :
- OpenAIRE
- Journal :
- 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
- Accession number :
- edsair.doi...........259f93535c0b64707eefeb91bae0059d
- Full Text :
- https://doi.org/10.1109/eurosime.2017.7926237