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Measurement and modeling of the annealing kinetics of stress induced leakage current in ultra-thin oxides
- Source :
- Microelectronics Reliability. 39:203-207
- Publication Year :
- 1999
- Publisher :
- Elsevier BV, 1999.
-
Abstract
- The annealing properties of the stress induced leakage current (SILC) for 55 and 65 Athick oxides are investigated. It is demonstrated that the SILC is a fully reversible degradation process and that its generation kinetics are nearly unchanged after successive stressing/annealing cycles. The activation energy and diffusion coefficient of the annealing process has been extracted and shown to be independent of oxide thickness. Moreover the annealing kinetics are quantitatively simulated using a drift-diffusion model with the experimentally extracted parameters.
- Subjects :
- Annealing (metallurgy)
Kinetics
Oxide
Activation energy
Condensed Matter Physics
Layer thickness
Atomic and Molecular Physics, and Optics
Reversible reaction
Surfaces, Coatings and Films
Electronic, Optical and Magnetic Materials
Condensed Matter::Materials Science
chemistry.chemical_compound
chemistry
Electronic engineering
SILC
Electrical and Electronic Engineering
Composite material
Degradation process
Safety, Risk, Reliability and Quality
Subjects
Details
- ISSN :
- 00262714
- Volume :
- 39
- Database :
- OpenAIRE
- Journal :
- Microelectronics Reliability
- Accession number :
- edsair.doi...........26b9f4dc15d3e91ecdb11824c7169a35