Dynamic response of curvilinearly stiffened plates under thermal environment

An improved finite element modeling method is developed for isotropic curvilinearly stiffened plates under a thermal environment. The existing modeling method for curvilinearly stiffened plates avoids the difficulty of node overlap, which is suitable for plates with different thicknesses. By introducing the influence of temperature on material parameters and thermal stress on additional stiffness, the existing method is improved and extended to the study of thermodynamics. The proposed method is verified by modal test at normal temperature and commercial finite element software at the thermal environment. The variation of dynamic characteristics with temperature under different boundary conditions was studied. Results show that when the boundary conditions are asymmetric, the influence of temperature on the thermal mode shape is more significant than the case of symmetrical.