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Failure Mechanism Analysis on Copper-Filled TSV Interposer Based on Transient Thermal Mechanical Stress Simulation

Authors :
Yunfei En
Hong-Zhong Huang
Su Wei
Peng Zhang
Ping Lai
Chen Yuan
Lin Xiaoling
Source :
Proceedings of the 29th European Safety and Reliability Conference (ESREL).
Publication Year :
2019
Publisher :
Research Publishing Services, 2019.

Subjects

Subjects :
Stress (mechanics)
Materials science
chemistry
Thermal mechanical
Interposer
chemistry.chemical_element
Failure mechanism
Transient (oscillation)
Composite material
Copper

Details

Database :
OpenAIRE
Journal :
Proceedings of the 29th European Safety and Reliability Conference (ESREL)
Accession number :
edsair.doi...........27baa90babf8766e451745d4405cfa8a
Full Text :
https://doi.org/10.3850/978-981-11-2724-3_0206-cd
Full Text Access
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