High-temperature Pb-free die attach material project phase 1: Survey result

High-Pb solders have been used as die-attach and interconnect materials since long time for discrete power packages, including MOSFET, smart power ASICs, IGBT modules and integrated power modules, operating under high-power and high-current operation environments. Due to the known harmful effects of Pb to human health and the environment, alternative Pb-free solders and other Pb-free solutions have been studied for decades. But, Pb-free alternatives to replace high-lead solders are still in the infant age and no recognized drop-in solution is available yet. The exemption of using high-Pb solders has been extended again to 2021. iNEMI initiated a project and conducted an industry-wide survey to benchmark the availability of Pb-free die bonding materials, the technological feasibility for the same and the ongoing industrial trend. Based on the survey results, this paper presents the insights on the industrial preferences and the potential lead-free materials.