High-performance hexagonal boron nitride/bismaleimide composites with high thermal conductivity, low coefficient of thermal expansion, and low dielectric loss

Authors :: Yuwen Gao
Yulu Yang
Yicheng Jiao
Jiang-tao Hu
Aijuan Gu
Guozheng Liang
Li Yuan
Wei Yao
Source :: Polymers for Advanced Technologies. 23:919-928
Publication Year :: 2011
Publisher :: Wiley, 2011.

Subjects :: Materials science
Thermal conductivity
Polymers and Plastics
Hexagonal boron nitride
Dielectric loss
Composite material
Thermal expansion

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