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25 nm iPMA-type Hexa-MTJ with solder reflow capability and endurance > 107 for eFlash-type MRAM

Authors :
H. Honjo
K. Nishioka
S. Miura
H. Naganuma
T. Watanabe
T. Nasuno
T. Tanigawa
Y. Noguchi
H. Inoue
M. Yasuhira
S. Ikeda
T. Endoh
Source :
2022 International Electron Devices Meeting (IEDM).
Publication Year :
2022
Publisher :
IEEE, 2022.

Details

Database :
OpenAIRE
Journal :
2022 International Electron Devices Meeting (IEDM)
Accession number :
edsair.doi...........2c4fd2d8b988ab8c9cc1cdc2997fd779

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