Warpage Analysis and Prediction of the Advanced Fan-Out Technology Based on Process Mechanics

Authors :: Li Rui
Zheng Feng
Jie Liu
Yameng Sun
Can Sheng
Lianghao Xue
Wang Shizhao
Sheng Liu
Source :: IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:2201-2213
Publication Year :: 2021
Publisher :: Institute of Electrical and Electronics Engineers (IEEE), 2021.

Subjects :: Computer science
Process (computing)
Fan-out
Mechanical engineering
Electrical and Electronic Engineering
Industrial and Manufacturing Engineering
Electronic, Optical and Magnetic Materials

ISSN :: 21563985 and 21563950
Volume :: 11
Database :: OpenAIRE
Journal :: IEEE Transactions on Components, Packaging and Manufacturing Technology
Accession number :: edsair.doi...........2d1b2af88bab30c20db9704856f3259a

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