Intermetallic compound evolution and mechanical properties of Cu/Sn58Bi/Cu 3D structures blended with B4C nanoparticles during isothermal aging

MLA

Chen Chen, et al. “Intermetallic Compound Evolution and Mechanical Properties of Cu/Sn58Bi/Cu 3D Structures Blended with B4C Nanoparticles during Isothermal Aging.” Journal of Materials Research and Technology, vol. 24, May 2023, pp. 3643–56. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........2d74a2221c9977170f81abbdfbafd8a0&authtype=sso&custid=ns315887.

APA

Chen Chen, Liang Zhang, Xi Wang, Xiao Lu, & Yong-huan Guo. (2023). Intermetallic compound evolution and mechanical properties of Cu/Sn58Bi/Cu 3D structures blended with B4C nanoparticles during isothermal aging. Journal of Materials Research and Technology, 24, 3643–3656.

Chicago

Chen Chen, Liang Zhang, Xi Wang, Xiao Lu, and Yong-huan Guo. 2023. “Intermetallic Compound Evolution and Mechanical Properties of Cu/Sn58Bi/Cu 3D Structures Blended with B4C Nanoparticles during Isothermal Aging.” Journal of Materials Research and Technology 24 (May): 3643–56. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........2d74a2221c9977170f81abbdfbafd8a0&authtype=sso&custid=ns315887.