High reliability high melting mixed lead-free BiAgX solder paste system

MLA

Ning-Cheng Lee, and HongWen Zhang. “High Reliability High Melting Mixed Lead-Free BiAgX Solder Paste System.” 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT), Nov. 2012. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........2df882cfd1c3a40afb75e427965b6e85&authtype=sso&custid=ns315887.

APA

Ning-Cheng Lee, & HongWen Zhang. (2012). High reliability high melting mixed lead-free BiAgX solder paste system. 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).

Chicago

Ning-Cheng Lee, and HongWen Zhang. 2012. “High Reliability High Melting Mixed Lead-Free BiAgX Solder Paste System.” 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT), November. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........2df882cfd1c3a40afb75e427965b6e85&authtype=sso&custid=ns315887.