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Photonic Integrated Circuit Design and Packaging for Submarine Optical Amplification
- Source :
- 2018 IEEE 7th International Conference on Photonics (ICP).
- Publication Year :
- 2018
- Publisher :
- IEEE, 2018.
-
Abstract
- This paper gives an insight into a Brazilian project which aims to develop a photonic integrated circuit (PIC) and packaging for submarine optical repeaters. The PIC design in order to achieve single-mode operation in both 980nm and 1.55 $\mu$ m is detailed. A high-reliability packaging technique is demonstrated. A transmission experiment with 200Gbps 16-QAM signal is achieved using the optical amplifier with the PIC.
Details
- Database :
- OpenAIRE
- Journal :
- 2018 IEEE 7th International Conference on Photonics (ICP)
- Accession number :
- edsair.doi...........315da4b97a7685b58f350b9edd408293
- Full Text :
- https://doi.org/10.1109/icp.2018.8533218