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Photonic Integrated Circuit Design and Packaging for Submarine Optical Amplification

Authors :
Marcio C. Argentato
M. Sro Rossi
Giovanni B. de Farias
João C. S. S. Januário
Uiara Celine de Moura
Source :
2018 IEEE 7th International Conference on Photonics (ICP).
Publication Year :
2018
Publisher :
IEEE, 2018.

Abstract

This paper gives an insight into a Brazilian project which aims to develop a photonic integrated circuit (PIC) and packaging for submarine optical repeaters. The PIC design in order to achieve single-mode operation in both 980nm and 1.55 $\mu$ m is detailed. A high-reliability packaging technique is demonstrated. A transmission experiment with 200Gbps 16-QAM signal is achieved using the optical amplifier with the PIC.

Details

Database :
OpenAIRE
Journal :
2018 IEEE 7th International Conference on Photonics (ICP)
Accession number :
edsair.doi...........315da4b97a7685b58f350b9edd408293
Full Text :
https://doi.org/10.1109/icp.2018.8533218