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Polishing of YBa2Cu3O7−yby He‐ion etching

Authors :
Toshio Shima
Takashi Sudo
Noriyuki Inoue
Yasuo Takahashi
Kageyoshi Sakamoto
Yoshitake Nishi
Source :
Journal of Applied Physics. 71:347-349
Publication Year :
1992
Publisher :
AIP Publishing, 1992.

Abstract

Clean polishing is performed by helium‐ion etching on a surface of high‐Tc YBa2Cu3O7−y. Based on a knock‐on cascade model, the decrease of surface roughness is discussed. A rate process of etching is applied for the surface roughness of the high‐Tc YBa2Cu3O7−y.

Details

ISSN :
10897550 and 00218979
Volume :
71
Database :
OpenAIRE
Journal :
Journal of Applied Physics
Accession number :
edsair.doi...........319337adb19a54b8946276fadda7380d