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Fabrication of terahertz metamaterials using electrohydrodynamic jet printing for sensitive detection of yeast
- Source :
- Journal of Micromechanics and Microengineering. 27:035009
- Publication Year :
- 2017
- Publisher :
- IOP Publishing, 2017.
-
Abstract
- We demonstrated the fabrication of terahertz metamaterial sensor for the accurate and on-site detection of yeast using electrohydrodynamic jet printing, which is inexpensive, simple, and environmentally friendly. The very small sized pattern up to 5 ?m-width of electrical split ring resonator unit structures could be printed on a large area on both a rigid substrate and flexible substrate, i.e. silicon wafer and polyimide film using the drop on demand technique to eject liquid ink containing silver nanoparticles. Experimental characterization and simulation were performed to study their performances in detecting yeast of different weights. It was shown that the metamaterial sensor fabricated on a flexible polyimide film had higher sensitivity by more than six times than the metamaterial sensor fabricated on a silicon wafer, due to the low refractive index of the PI substrate and due to the extremely thin substrate thickness which lowers the effective index further. The resonance frequency shift saturated when the yeast weights were 145 ?g and 215 ?g for metamaterial structures with gap size 6.5 ?m fabricated on the silicon substrate and on the polyimide substrate, respectively.
- Subjects :
- Materials science
Fabrication
Silicon
Terahertz radiation
business.industry
Mechanical Engineering
Metamaterial
chemistry.chemical_element
02 engineering and technology
Substrate (printing)
021001 nanoscience & nanotechnology
01 natural sciences
Electronic, Optical and Magnetic Materials
010309 optics
Split-ring resonator
chemistry
Mechanics of Materials
0103 physical sciences
Electronic engineering
Optoelectronics
Wafer
Electrical and Electronic Engineering
0210 nano-technology
business
Polyimide
Subjects
Details
- ISSN :
- 13616439 and 09601317
- Volume :
- 27
- Database :
- OpenAIRE
- Journal :
- Journal of Micromechanics and Microengineering
- Accession number :
- edsair.doi...........358000e471226e1f13f37fea6451fc0f