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Direct Evidence for Stability of Tetrahedral Interstitial Er in Si up to 900°C
- Source :
- Materials Science Forum. :1503-1508
- Publication Year :
- 1997
- Publisher :
- Trans Tech Publications, Ltd., 1997.
Details
- ISSN :
- 16629752
- Database :
- OpenAIRE
- Journal :
- Materials Science Forum
- Accession number :
- edsair.doi...........3808b7d51628b8c440089fd11b5039f5
- Full Text :
- https://doi.org/10.4028/www.scientific.net/msf.258-263.1503