Low temperature Cu–Cu bonding by transient liquid phase sintering of mixed Cu nanoparticles and Sn–Bi eutectic powders

MLA

Kazuma Bansho, et al. “Low Temperature Cu–Cu Bonding by Transient Liquid Phase Sintering of Mixed Cu Nanoparticles and Sn–Bi Eutectic Powders.” Journal of Materials Science: Materials in Electronics, vol. 28, July 2017, pp. 16433–43. EBSCOhost, https://doi.org/10.1007/s10854-017-7554-6.

APA

Kazuma Bansho, M. Khairi Faiz, Tomoyuki Miyashita, Makoto Yoshida, & Tadatomo Suga. (2017). Low temperature Cu–Cu bonding by transient liquid phase sintering of mixed Cu nanoparticles and Sn–Bi eutectic powders. Journal of Materials Science: Materials in Electronics, 28, 16433–16443. https://doi.org/10.1007/s10854-017-7554-6

Chicago

Kazuma Bansho, M. Khairi Faiz, Tomoyuki Miyashita, Makoto Yoshida, and Tadatomo Suga. 2017. “Low Temperature Cu–Cu Bonding by Transient Liquid Phase Sintering of Mixed Cu Nanoparticles and Sn–Bi Eutectic Powders.” Journal of Materials Science: Materials in Electronics 28 (July): 16433–43. doi:10.1007/s10854-017-7554-6.