Back to Search
Start Over
Failure Strength Analysis and Young Modulus Assessment of 4H-SiC through a Ball on Ring Test
- Source :
- 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
- Publication Year :
- 2022
- Publisher :
- IEEE, 2022.
Details
- Database :
- OpenAIRE
- Journal :
- 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
- Accession number :
- edsair.doi...........3ac60bd37af77dc71f6e56dda9a367e4
- Full Text :
- https://doi.org/10.1109/eurosime54907.2022.9758855