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Usage of offset printing technology for printed electronics and smart labels

Authors :
Michal Kerndl
Pavel Steffan
Source :
TSP
Publication Year :
2020
Publisher :
IEEE, 2020.

Abstract

Printed electronics is key segment in modern fabrication of ultra-low-cost RFID/NFC/RF tags, smart labels, packaging, sensors etc. This paper shows the opportunity of usage of well known printing process called "offset printing" or "offset lithography". It is widely spread and well developed industry, but rarely used for printed electronics and smart tags. This work proposes usage of offset press on variety of substrates at high speed and large capacity production of printed electronics and also points to a connection of a lot of post-press technologies such as foil lamination, cutting, die-cutting, embossing, gluing etc. This additive technology provides an open door for smart packaging manufacturing, simply the RFID antenna can be printed by offset press directly on the substrate (usually paper) that is forming the box, smart label or sticker. Variety of substrates is also well maintained, offset press is usually equipped with UV, IR or hot air drying units, that enables printing on flexible substrates. More printing units also provides the technological possibility of layers overprinting.

Details

Database :
OpenAIRE
Journal :
2020 43rd International Conference on Telecommunications and Signal Processing (TSP)
Accession number :
edsair.doi...........3bddb8a735225946b51e0d4d40705f27