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Frequency-Domain Thermal Coupling Model of Multi-Chip Power Module
- Source :
- IEEE Transactions on Power Electronics. 38:6522-6532
- Publication Year :
- 2023
- Publisher :
- Institute of Electrical and Electronics Engineers (IEEE), 2023.
- Subjects :
- Electrical and Electronic Engineering
Subjects
Details
- ISSN :
- 19410107 and 08858993
- Volume :
- 38
- Database :
- OpenAIRE
- Journal :
- IEEE Transactions on Power Electronics
- Accession number :
- edsair.doi...........3cccb82ef916f689ffc83c10059aaf80
- Full Text :
- https://doi.org/10.1109/tpel.2023.3236250