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Revealing the maximum microhardness and thickness of hardened layers for copper with various grain sizes

Authors :
Z.J. Zhang
Zhefeng Zhang
Qiang Wang
C.X. Ren
Huajie Yang
Jinliang Hou
Source :
Materials Science and Engineering: A. 778:139113
Publication Year :
2020
Publisher :
Elsevier BV, 2020.

Abstract

Surface strengthened Cu samples with ultra-fine grain (UFG), fine grain (FG), and coarse grain (CG) matrixes were prepared by cold-rolling, controlled annealing, and then treated by surface spinning strengthening (3S) to reveal the effect of grain size on the feature of the hardened layer. The results indicate that the maximum microhardness of the hardened layer was slightly affected by grain size. The thickness of the hardened layer is significantly influenced by grain size. When decreasing the grain size of matrix from CG to UFG, the thickness of the hardened layer displays an increasing then deceasing trend, and approaches in the highest thickness at FG.

Details

ISSN :
09215093
Volume :
778
Database :
OpenAIRE
Journal :
Materials Science and Engineering: A
Accession number :
edsair.doi...........3d282290f10805c13b7f9ffbef242add
Full Text :
https://doi.org/10.1016/j.msea.2020.139113