Study of the evolution of the Cu/Nb interphase boundary by the molecular dynamics method

The evolution of atomic structure of the interphase boundary for composites from immiscible Cu/Nb elements is studied by the molecular dynamics method. It is established that the planar interphase boundary is stable at temperatures up to 1200 K. Atomic dissolution of elements is not revealed in the entire examined temperature interval, and the components are mixed on the interphase boundary of finite curvature in the form of clusters and nanolamellas; moreover, the amorphous state is not formed in the process of migration of the interphase boundary.