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Influence of Residual Stress on the Thermal Expansion Behavior of Electroformed Nickel Layers

Authors :
Jia Min Zhang
Yichun Liu
Jian Hong Yi
Source :
Advanced Materials Research. 662:511-514
Publication Year :
2013
Publisher :
Trans Tech Publications, Ltd., 2013.

Abstract

Nickel layers with tensile or pressure residual stress were prepared by electroforming technique from two kinds of electrolyte. Subsequent heat treatment was adopted to get the stress released. The coefficients of thermal expansion (CTEs) were measured with a thermal dilatometer and the relationship between residual stress and the measured CTEs was revealed both from experimental results and theoretical analysis.

Details

ISSN :
16628985
Volume :
662
Database :
OpenAIRE
Journal :
Advanced Materials Research
Accession number :
edsair.doi...........40204ca30ca0f065d6b9cb059e2a8e1b