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Present and Future of Build-up PWB's-Their Possibility and Limitation. The Status and Future of Build-up PCB

Authors :
Yutaka Tsukada
Source :
Journal of Japan Institute of Electronics Packaging. 2:426-429
Publication Year :
1999
Publisher :
Japan Institute of Electronics Packaging, 1999.

Subjects

Subjects :
Electrical and Electronic Engineering

Details

ISSN :
1884121X and 13439677
Volume :
2
Database :
OpenAIRE
Journal :
Journal of Japan Institute of Electronics Packaging
Accession number :
edsair.doi...........4167d55a76838fe49b61400235bc7838
Full Text :
https://doi.org/10.5104/jiep.2.426
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