Back to Search
Start Over
A Novel Structure of Bondwire and Microstrip Lines for Chip-to-Chip Inter-Connection Up to 130GHz
- Source :
- 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS).
- Publication Year :
- 2020
- Publisher :
- IEEE, 2020.
-
Abstract
- A novel structure of bondwire and microstrip lines for Chip-to-Chip inter-connection up to 130GHz is firstly pre-sented in this paper. Its realization is based on PCB heterogeneous integration process. In order to reduce its high inserted loss which mainly caused of high inductance of the bondwire, the microstrip line of the structure is then optimized. Simulated results show that the minimum insertion loss of 1.0 dB for the structure can be achieved, with the bandwidth more than 35 GHz in bands of 100-135 GHz.
- Subjects :
- 010302 applied physics
0209 industrial biotechnology
Materials science
business.industry
Connection (vector bundle)
Bandwidth (signal processing)
Structure (category theory)
02 engineering and technology
Chip
01 natural sciences
Microstrip
Inductance
020901 industrial engineering & automation
0103 physical sciences
Optoelectronics
Insertion loss
business
Realization (systems)
Subjects
Details
- Database :
- OpenAIRE
- Journal :
- 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
- Accession number :
- edsair.doi...........48185619841829d13761269eca78438c