Study on PoP (package-on-package) Assembly Technology

Authors :: Guo Hong Li
Hong Zhen Yang
Xin Yu Cao
Source :: 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits.
Publication Year :: 2009
Publisher :: IEEE, 2009.
Abstract: This paper analyzes the main factors that affect PoP assembly process quality, and proposes solutions to these problems. The technology is simple, easy-to-use, flexible, and controllable. This technology can make use of the existing SMT equipment, can lower production costs and improve production efficiency and yield.

Subjects :: Process quality
Engineering
business.industry
Chip-scale package
Embedded system
Package on package
Production (economics)
SMT placement equipment
Process control
Production efficiency
business
Manufacturing engineering

Database :: OpenAIRE
Journal :: 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits
Accession number :: edsair.doi...........49b097dcd83cbd6fa0ff7e11d89d64ea

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