A robust and reliable stress-induced self-assembly supporting mechanism for optical devices

The stress-induced supporting mechanism consisting of stress-induced bending beams and novel locking component used to assemble the micromachined optical devices has been realized. The tip deflection of the stress-induced bending beams has been exploited to lift up the micromachined devices. Based on the MUMPs platform, this study has successfully established an improved surface micromachining process (MUMPs-like process) to enhance the reliability of the stress-induced beams. According to the reliability test, the variation of the tip displacement is <