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Pulse-pressure diffusion bonding of Ti-6Al-4 V alloy with nanostructured Cu-W multilayer film as interlayer

Authors :
Hong Li
Bo-jin Li
Zeng-cheng Xing
Erika Hodúlová
Yi-peng Wang
Benjamin Lehmert
Zhuo-xin Li
Wolfgang Tillmann
Source :
Welding in the World. 67:1337-1345
Publication Year :
2023
Publisher :
Springer Science and Business Media LLC, 2023.

Subjects

Subjects :
Mechanics of Materials
Mechanical Engineering
Metals and Alloys

Details

ISSN :
18786669 and 00432288
Volume :
67
Database :
OpenAIRE
Journal :
Welding in the World
Accession number :
edsair.doi...........4a876258b6d7368329aa382c8b275506

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