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A convenient wafer level bonding based on unpatterned BCB

Authors :
Ningli Zhu
Li Song
Li Lei
Xia Wen
Weiguo Su
Wei Zhang
Deng Kangfa
Source :
NEMS
Publication Year :
2014
Publisher :
IEEE, 2014.

Subjects

Subjects :
Materials science
Anodic bonding
business.industry
Optoelectronics
Wafer
business

Details

Database :
OpenAIRE
Journal :
The 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)
Accession number :
edsair.doi...........4ae24c0c0179fcb1ea0b8296fd25ead5

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