Preparation and characterization of ultrasonic electrodeposited copper coating

MLA

Ronghong Cui, et al. “Preparation and Characterization of Ultrasonic Electrodeposited Copper Coating.” 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Aug. 2010. EBSCOhost, https://doi.org/10.1109/icept.2010.5582413.

APA

Ronghong Cui, Jinqiang Du, Zhi Ming Yu, Wenjun Shu, & Yuting He. (2010). Preparation and characterization of ultrasonic electrodeposited copper coating. 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging. https://doi.org/10.1109/icept.2010.5582413

Chicago

Ronghong Cui, Jinqiang Du, Zhi Ming Yu, Wenjun Shu, and Yuting He. 2010. “Preparation and Characterization of Ultrasonic Electrodeposited Copper Coating.” 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, August. doi:10.1109/icept.2010.5582413.