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Negative correlation between in-plane bonding strength and cross-plane thermal conductivity in a model layered material

Authors :
Yunfei Chen
Chris Dames
Zhiyong Wei
Source :
Applied Physics Letters. 102:011901
Publication Year :
2013
Publisher :
AIP Publishing, 2013.

Abstract

The effects of in-plane (IP) and cross-plane (CP) interatomic bonding strengths on the IP and CP thermal conductivities of a model layered material are investigated using molecular dynamics and lattice dynamics. Increasing the IP bonding strength while holding the CP bonding constant increases the IP thermal conductivity, but reduces the CP thermal conductivity. Analogous but weaker trends are seen when increasing the CP bonding strength while holding the IP bonding constant. These results show how both low- and high-symmetry directions must be considered to understand the effects of phonon focusing on the thermal conductivity tensor of highly anisotropic materials.

Details

ISSN :
10773118 and 00036951
Volume :
102
Database :
OpenAIRE
Journal :
Applied Physics Letters
Accession number :
edsair.doi...........4cbcca19a911d434dbef896a8a11836c
Full Text :
https://doi.org/10.1063/1.4773372