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Negative correlation between in-plane bonding strength and cross-plane thermal conductivity in a model layered material
- Source :
- Applied Physics Letters. 102:011901
- Publication Year :
- 2013
- Publisher :
- AIP Publishing, 2013.
-
Abstract
- The effects of in-plane (IP) and cross-plane (CP) interatomic bonding strengths on the IP and CP thermal conductivities of a model layered material are investigated using molecular dynamics and lattice dynamics. Increasing the IP bonding strength while holding the CP bonding constant increases the IP thermal conductivity, but reduces the CP thermal conductivity. Analogous but weaker trends are seen when increasing the CP bonding strength while holding the IP bonding constant. These results show how both low- and high-symmetry directions must be considered to understand the effects of phonon focusing on the thermal conductivity tensor of highly anisotropic materials.
- Subjects :
- Physics and Astronomy (miscellaneous)
Condensed matter physics
Plane (geometry)
Phonon
Chemistry
02 engineering and technology
021001 nanoscience & nanotechnology
01 natural sciences
Molecular dynamics
Thermal conductivity
0103 physical sciences
Thermal
Tensor
010306 general physics
0210 nano-technology
Constant (mathematics)
Anisotropy
Subjects
Details
- ISSN :
- 10773118 and 00036951
- Volume :
- 102
- Database :
- OpenAIRE
- Journal :
- Applied Physics Letters
- Accession number :
- edsair.doi...........4cbcca19a911d434dbef896a8a11836c
- Full Text :
- https://doi.org/10.1063/1.4773372