Cite
Design and signal integrity analysis of high bandwidth memory (HBM) interposer in 2.5D terabyte/s bandwidth graphics module
MLA
Kyungjun Cho, et al. “Design and Signal Integrity Analysis of High Bandwidth Memory (HBM) Interposer in 2.5D Terabyte/s Bandwidth Graphics Module.” 2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS), Oct. 2015. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........4f15d4b2fa4365bee0ca329ed2362c21&authtype=sso&custid=ns315887.
APA
Kyungjun Cho, Jaemin Lim, Hyunwoo Shim, Heegon Kim, Hyunsuk Lee, Joungho Kim, & Sumin Choi. (2015). Design and signal integrity analysis of high bandwidth memory (HBM) interposer in 2.5D terabyte/s bandwidth graphics module. 2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS).
Chicago
Kyungjun Cho, Jaemin Lim, Hyunwoo Shim, Heegon Kim, Hyunsuk Lee, Joungho Kim, and Sumin Choi. 2015. “Design and Signal Integrity Analysis of High Bandwidth Memory (HBM) Interposer in 2.5D Terabyte/s Bandwidth Graphics Module.” 2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS), October. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........4f15d4b2fa4365bee0ca329ed2362c21&authtype=sso&custid=ns315887.