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Modeling and experimentation of creep-fatigue and failure of low-profile quad flat package under thermal cycle
- Source :
- Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science. 234:4277-4287
- Publication Year :
- 2020
- Publisher :
- SAGE Publications, 2020.
-
Abstract
- An experimental investigation and numerical modeling using multiphysics finite element method were performed to study the thermal failure mechanism of low-profile quad flat package solder joints of memory module due to low-cycle fatigue. The strain, stress, and number of cycles to failure have been calculated according to a strain life Coffin–Manson and energy-based Morrow fatigue models. Scanning electron microscopy imaging at the end of thermal cycle was used to evaluate the damage initiation and propagation. The effect of the solder volume on fatigue life of solder joints was discussed. Through analyses of theoretical results and experimental data on fatigue life, cracks initiation and propagation have been highlighted and their possible causes have been discussed.
- Subjects :
- Materials science
business.industry
Mechanical Engineering
Multiphysics
Thermal cycle
02 engineering and technology
Structural engineering
Creep fatigue
021001 nanoscience & nanotechnology
Finite element method
020303 mechanical engineering & transports
0203 mechanical engineering
Creep
Soldering
Thermal
Quad Flat Package
0210 nano-technology
business
Subjects
Details
- ISSN :
- 20412983 and 09544062
- Volume :
- 234
- Database :
- OpenAIRE
- Journal :
- Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science
- Accession number :
- edsair.doi...........4f5c4c1bae9d78419069926dbcec7afc