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Study on the solid-solid interfacial reaction behavior of solder micro bump prepared by laser assisted bonding
- Source :
- 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
- Publication Year :
- 2022
- Publisher :
- IEEE, 2022.
Details
- Database :
- OpenAIRE
- Journal :
- 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
- Accession number :
- edsair.doi...........50486eb8b0a89a256452f587dbe832e8
- Full Text :
- https://doi.org/10.1109/icept56209.2022.9873234