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Self-aligned Tilted Amplifier Array Packaging using Si V-groove Flip-Chip Technique for Gate Array Applications
- Source :
- Optical Amplifiers and Their Applications.
- Publication Year :
- 1994
- Publisher :
- OSA, 1994.
-
Abstract
- For the first time an optical self-aligned flip-chip packaging technique for tilted amplifier arrays using Si V-grooves and angle polished fiber arrays with fiber-to-fiber gain of 8±1 dB and ripple < 0.2 dB is demonstrated.
Details
- Database :
- OpenAIRE
- Journal :
- Optical Amplifiers and Their Applications
- Accession number :
- edsair.doi...........5126d5ef61dfdb60f893f66f1d5db0f8